Applications

MEMS & sensors

MEMS is a one-product-one-process world. Every accelerometer, microphone, pressure sensor or micromirror carries its own structural signature — which makes equipment selection an application problem first and a procurement problem second.

The process challenges that recur

High-aspect-ratio silicon

Deep cavities, comb fingers and through-wafer vias demand controlled sidewall profiles, uniform depth across the wafer and repeatability from lot to lot.

Releasing moving structures

Sacrificial-layer removal must free the structure without stiction, corrosion or damage to exposed materials — chemistry and endpoint discipline decide yield.

Film stress that behaves

Structural and passivation films need engineered stress, thickness uniformity and thermal budgets compatible with everything already on the wafer.

Typical process steps we support

  • Deep reactive ion etch (Si DRIE) for structures and TSV
  • Vapor-phase HF sacrificial oxide release
  • Low-stress SiN and thick SiO₂ PECVD
  • Oxidation, diffusion and LPCVD in batch furnaces
  • Compound and dielectric RIE

How we help

Translate the device into equipment language

We turn your structure and acceptance criteria into a platform and configuration question the manufacturer can answer precisely.

Define demos that mean something

Sample plans, mask sets and written success metrics agreed before processing — so a demo result is evidence, not marketing.

Plan for production, not just first silicon

Automation level, chamber count, uptime expectations and service coverage are part of the first conversation, not the last.

What to prepare for a first discussion

  • Device type and target application
  • Structure: target depth, CD, aspect ratio, profile
  • Substrate and mask materials, wafer size
  • Critical acceptance metrics (uniformity, roughness, damage)
  • R&D or production; expected throughput
  • Project timeline and current stage

Discuss your process

Have a structure, film or thermal step to discuss?

Send a short description of your application — device type, material, wafer size and what a good result looks like. An engineer will reply with a concrete next step.

Start the conversation