Applications
Start from what you build
The same five questions decide most specialty equipment projects: structure, material, wafer size, acceptance criteria and volume. Pick your field — each page walks through the process challenges and the equipment questions that follow.
MEMS & sensors
MEMS is a one-product-one-process world. Every accelerometer, microphone, pressure sensor or micromirror carries its own structural signature — which makes equipment selection an application problem first and a procurement problem second.
- Deep reactive ion etch (Si DRIE) for structures and TSV
- Vapor-phase HF sacrificial oxide release
- Low-stress SiN and thick SiO₂ PECVD
SiC & GaN power devices
The power market has moved from a race for capacity to a race for yield, cost and 8-inch maturity. That shifts the equipment question: not “who can etch SiC”, but “who can hit your trench profile, damage budget and repeatability at production volume”.
- SiC trench and mesa etch
- GaN / AlGaN low-damage etch
- SiN and SiO₂ passivation PECVD
RF & photonics
In RF and photonic devices, geometry is the function. Waveguide sidewall roughness becomes optical loss, facet angle becomes coupling efficiency and film thickness becomes centre frequency. Equipment evaluation must be measured in the units of your device.
- Precision dielectric and compound RIE
- Deep silicon etch for optical benches and MEMS mirrors
- Optical-grade SiO₂ / SiN PECVD
Advanced packaging
Advanced packaging is a system of many process families — we focus on the steps where plasma etch and deposition decide feasibility: through-silicon vias, cavity formation and low-temperature dielectric films.
- TSV and interposer silicon etch
- Cavity and pillar formation
- Low-temperature SiO₂ / SiN PECVD
R&D & pilot lines
Research platforms live a different life: many users, many materials, frequent changeover — and one day, a process that must transfer to production. Buying for flexibility today and transferability tomorrow is the core selection problem.
- Open-configuration DRIE and RIE
- Research PECVD with multi-material capability
- Vapor-phase HF release for MEMS research
Have a structure, film or thermal step to discuss?
Send a short description of your application — device type, material, wafer size and what a good result looks like. An engineer will reply with a concrete next step.