Industry
Where this industry meets and publishes
A working reference we keep for ourselves and share openly: the events where specialty process equipment is actually discussed, and the sources we read to stay current. Links go to the organisers and publishers directly.
Trade shows & technical conferences
Grouped by region. Past events drop off automatically; dates are taken from the organiser and marked when not yet announced.
Greater China
- Sep 2 – Sep 4 2026SEMICON TaiwanTaiwan's foundry and advanced-packaging supply chain in one hall; conferences start 31 Aug.Taipei, TaiNEX 1 & 2
- Mar 21 – Mar 23 2027China Semiconductor Technology International ConferenceCSTIC 2027The academic entrance to mainland fab process and R&D decision-makers. Abstracts close 30 Sep 2026.Shanghai International Convention Center
- Mar 24 – Mar 26 2027productronica ShanghaiBack-end, packaging and electronics manufacturing equipment. Renamed from productronica China.Shanghai, SNIEC
- Mar 24 – Mar 26 2027SEMICON ChinaThe anchor event of the year for equipment procurement and channels in mainland China.Shanghai, SNIEC
- June 2027 · Taipei — organiser has not posted final datesIEEE International Symposium on Power Semiconductor Devices and ICsISPSD 2027The flagship power-device conference, in Taipei for the first time — convenient for customers on both sides of the strait.Taipei
Asia-Pacific
- Sep 27 – Oct 2 2026International Conference on Silicon Carbide and Related MaterialsICSCRM 2026The reference conference for silicon carbide, from substrate through device.Yokohama, PACIFICO North
- Nov 8 – Nov 13 2026International Workshop on Nitride SemiconductorsIWN 2026Biennial workshop on GaN and nitride materials, epitaxy and devices.Kumamoto, Japan
- Dec 9 – Dec 11 2026SEMICON JapanWhere Japanese equipment and materials makers show once a year, including MEMS and compound tooling.Tokyo Big Sight
- Feb 17 – Feb 19 2027SEMICON KoreaMemory and advanced-packaging procurement chain in Korea.Seoul, COEX
- May 25 – May 27 2027SEMICON Southeast AsiaSEMICON SEA 2027Southeast Asian OSAT and capacity relocation. The show alternates between Malaysia and Singapore.Kuala Lumpur, MITEC
Europe
- Nov 10 – Nov 13 2026SEMICON EuropaEurope's IDMs and research institutes in one place; co-located with electronica in even years.Munich, Messe München
- Apr 12 – Apr 14 2027CS InternationalThe densest commercial gathering for compound semiconductors, co-located with PIC and Power Electronics International.Brussels, Sheraton Brussels Airport
- May 11 – May 13 2027PCIM Expo & ConferenceEurope's largest power electronics show — the demand side for SiC and GaN device lines.Nuremberg
- Jun 20 – Jun 24 2027Transducers 2027 – EUROSENSORS XXXIXThe other flagship MEMS conference, now merged with EUROSENSORS. Abstracts close 8 Dec 2026.Stockholm Waterfront
- Sep 19 – Sep 24 2027International Conference on Silicon Carbide and Related MaterialsICSCRM 202724th edition; the annual fixture for anyone working on silicon carbide.Newport, ICC Wales
- November 2026 · during SEMICON Europa — exact dates to be confirmedMEMS & Imaging Sensors SummitSmall, senior European gathering for MEMS and imaging sensor decision-makers.Munich
Americas
- Oct 13 – Oct 15 2026SEMICON WestThe last San Francisco edition — from 2027 the show moves to Phoenix and to a spring slot.San Francisco, Moscone Center
- Dec 12 – Dec 16 2026IEEE International Electron Devices MeetingIEDM 2026The device-level bellwether — read it to see where SiC and GaN roadmaps are heading.San Francisco, Hilton Union Square
- Jan 17 – Jan 21 2027IEEE International Conference on Micro Electro Mechanical SystemsIEEE MEMS 2027One of the two flagship academic MEMS conferences; useful for university and pilot-line contacts.Waikoloa, Hawaii
- Mar 30 – Apr 1 2027SEMICON WestFirst Phoenix edition and first spring slot, moving the show next to the Arizona fab cluster.Phoenix Convention Center
- May 5 – May 7 2027Sensors ConvergeSensor application and system side rather than the fab side.Santa Clara Convention Center
- Jun 1 – Jun 4 2027IEEE Electronic Components and Technology ConferenceECTC 2027The world's leading advanced-packaging technical conference: HBM, hybrid bonding, chiplets.Denver, Gaylord Rockies
Associations, research and trade media
A short, opinionated list rather than a directory — these are the sources that actually cover MEMS, power, compound semiconductor and advanced packaging.
Associations & standards
- China Semiconductor Industry Association中国半导体行业协会Has dedicated MEMS, discrete device and packaging/test branches — close to our segments.
- ECPE European Center for Power ElectronicsEurope's power electronics research network — automotive power modules, reliability working groups.
- IEEE Electron Devices SocietyPower, sensors, MEMS and photovoltaics; publishes T-ED and EDL and runs IEDM.
- MEMS & Sensors Industry GroupThe MEMS and sensor community inside SEMI; runs MSEC and MSTC.
- Semiconductor Equipment Association of Japan日本半導体製造装置協会（SEAJ）Monthly equipment billings and the global equipment forecast — the reference series for the tool market.
- SEMIThe global equipment and materials association: standards, SEMICON shows and market data.
- SEMI ChinaSEMI 中国SEMICON China, standards work and mainland market data.
- Taiwan Semiconductor Industry Association台灣半導體產業協會Quarterly Taiwan IC output data; Taiwan's WSTS and WSC representative.
Market research & data
- MEMS Consulting麦姆斯咨询The only dedicated MEMS and sensor research house working in Chinese.
- SEMI Market IntelligenceWorld Fab Forecast plus a dedicated Power & Compound Fab Outlook — the closest fit to this site's segments.
- TechInsightsReverse engineering, teardowns and cost analysis, with explicit advanced-packaging coverage.
- TechSearch InternationalAdvanced packaging specialists since 1987: flip chip, WLP, power-device and automotive packaging.
- TrendForce集邦科技 / 集邦咨询Memory, foundry, LED and a compound semiconductor research line; widely quoted across Greater China.
- Yole GroupThe reference house for MEMS, power, compound semiconductor and packaging — reports plus teardowns.
Trade media — Simplified Chinese
- China Electronics News中国电子报The MIIT-supervised trade paper — read it for policy direction. Linked to its digital edition, which is reachable worldwide.
- EEFocus与非网Electronics portal with genuine SiC/MOSFET, MEMS and advanced-packaging coverage, plus an engineer community.
- EE Times China电子工程专辑Has a dedicated power management and power device section for design engineers.
- IJIWEI爱集微 / 集微网Supply-chain news and capital-market coverage across the mainland ICT industry.
- MEMS.me微迷MEMS and sensor market coverage, run by MEMS Consulting.
- Semiconductor Industry Observation半导体行业观察The most widely read original semiconductor publication in mainland China.
Trade media — Traditional Chinese
- CTIMES零組件雜誌Components and subsystems since 1991 — closer to design and procurement than to the fab.
- DIGITIMES AsiaThe English sister title, for readers who do not work in Chinese.
- DIGITIMES電子時報Taiwan's deepest supply-chain daily; its semiconductor channel covers compound and power devices. Paywalled.
- TechNews科技新報Free to read, with a semiconductor vertical covering fabs, IC design and packaging/test.
Trade media — Japanese
- EDN JapanDesign-side sister title: analog, power devices, sensors and measurement.
- EE Times JapanSections for MEMS/sensing, power devices and advanced packaging — the closest Japanese fit.
- Nikkei xTECH日経クロステックNikkei BP's technology platform and the gateway to Nikkei Electronics. Partly paywalled.
- Electronic Device Industry News電子デバイス産業新聞Weekly trade paper on devices, components and manufacturing equipment. Formerly Semiconductor Industry News.
Trade media — English
- 3D InCitesThe advanced-packaging community platform — blogs, podcasts, white papers. Now part of IMAPS.
- Chip Scale ReviewPackaging quarterly: hybrid bonding, 3D IC, chiplets, packaging equipment and test. Free digital edition.
- Compound SemiconductorWhole-chain compound semiconductor news; the publisher also runs CS International.
- EE TimesBroad electronics industry news and analysis, with IC and power electronics desks.
- Power Electronics NewsThe most focused wide-bandgap title: GaN and SiC devices, conversion, battery.
- Semiconductor DigestSuccessor to Solid State Technology, whose 30-year archive it hosts. Covers MEMS and fab process.
- Semiconductor TodayPure compound semiconductor: GaN, SiC, GaAs, InP, LED and photonics. The best fit on this list.
- Semiconductor EngineeringIndependent and free; unusually strong on advanced packaging and chiplets.
Trade media — German & French
- eeNews EuropePan-European electronics news in English, with a dedicated power channel.
- ElectroniqueSFrench-language coverage of semiconductors, power, RF and sensors across automotive, industrial and space.
- Markt&Technik / elektroniknet.deThe German-language reference for semiconductors, power and optoelectronics.
- ElektronikPraxisSemiconductor technology, power design and electronics manufacturing for German engineers.
All links lead to third-party sites. RayFan is not affiliated with these organisations and does not control their content.
Meeting at one of these events?
If your team will be at any of these, tell us which process step you are evaluating and we will come prepared rather than hand you a brochure.