Secteur
Où ce secteur se rencontre et publie
Une liste de travail que nous tenons pour nous-mêmes et partageons ouvertement : les événements où les équipements de procédé spécialisés sont réellement discutés, et les sources que nous lisons. Tous les liens mènent directement aux organisateurs et aux éditeurs.
Salons et conférences techniques
Regroupés par région. Les événements passés disparaissent automatiquement ; les dates proviennent de l’organisateur et sont signalées lorsqu’elles ne sont pas encore annoncées.
Grande Chine
- 2 sept. – 4 sept. 2026SEMICON TaiwanTaiwan's foundry and advanced-packaging supply chain in one hall; conferences start 31 Aug.Taipei, TaiNEX 1 & 2
- 21 mars – 23 mars 2027China Semiconductor Technology International ConferenceCSTIC 2027The academic entrance to mainland fab process and R&D decision-makers. Abstracts close 30 Sep 2026.Shanghai International Convention Center
- 24 mars – 26 mars 2027productronica ShanghaiBack-end, packaging and electronics manufacturing equipment. Renamed from productronica China.Shanghai, SNIEC
- 24 mars – 26 mars 2027SEMICON ChinaThe anchor event of the year for equipment procurement and channels in mainland China.Shanghai, SNIEC
- June 2027 · Taipei — organiser has not posted final datesIEEE International Symposium on Power Semiconductor Devices and ICsISPSD 2027The flagship power-device conference, in Taipei for the first time — convenient for customers on both sides of the strait.Taipei
Asie-Pacifique
- 27 sept. – 2 oct. 2026International Conference on Silicon Carbide and Related MaterialsICSCRM 2026The reference conference for silicon carbide, from substrate through device.Yokohama, PACIFICO North
- 8 nov. – 13 nov. 2026International Workshop on Nitride SemiconductorsIWN 2026Biennial workshop on GaN and nitride materials, epitaxy and devices.Kumamoto, Japan
- 9 déc. – 11 déc. 2026SEMICON JapanWhere Japanese equipment and materials makers show once a year, including MEMS and compound tooling.Tokyo Big Sight
- 17 févr. – 19 févr. 2027SEMICON KoreaMemory and advanced-packaging procurement chain in Korea.Seoul, COEX
- 25 mai – 27 mai 2027SEMICON Southeast AsiaSEMICON SEA 2027Southeast Asian OSAT and capacity relocation. The show alternates between Malaysia and Singapore.Kuala Lumpur, MITEC
Europe
- 10 nov. – 13 nov. 2026SEMICON EuropaEurope's IDMs and research institutes in one place; co-located with electronica in even years.Munich, Messe München
- 12 avr. – 14 avr. 2027CS InternationalThe densest commercial gathering for compound semiconductors, co-located with PIC and Power Electronics International.Brussels, Sheraton Brussels Airport
- 11 mai – 13 mai 2027PCIM Expo & ConferenceEurope's largest power electronics show — the demand side for SiC and GaN device lines.Nuremberg
- 20 juin – 24 juin 2027Transducers 2027 – EUROSENSORS XXXIXThe other flagship MEMS conference, now merged with EUROSENSORS. Abstracts close 8 Dec 2026.Stockholm Waterfront
- 19 sept. – 24 sept. 2027International Conference on Silicon Carbide and Related MaterialsICSCRM 202724th edition; the annual fixture for anyone working on silicon carbide.Newport, ICC Wales
- November 2026 · during SEMICON Europa — exact dates to be confirmedMEMS & Imaging Sensors SummitSmall, senior European gathering for MEMS and imaging sensor decision-makers.Munich
Amériques
- 13 oct. – 15 oct. 2026SEMICON WestThe last San Francisco edition — from 2027 the show moves to Phoenix and to a spring slot.San Francisco, Moscone Center
- 12 déc. – 16 déc. 2026IEEE International Electron Devices MeetingIEDM 2026The device-level bellwether — read it to see where SiC and GaN roadmaps are heading.San Francisco, Hilton Union Square
- 17 janv. – 21 janv. 2027IEEE International Conference on Micro Electro Mechanical SystemsIEEE MEMS 2027One of the two flagship academic MEMS conferences; useful for university and pilot-line contacts.Waikoloa, Hawaii
- 30 mars – 1 avr. 2027SEMICON WestFirst Phoenix edition and first spring slot, moving the show next to the Arizona fab cluster.Phoenix Convention Center
- 5 mai – 7 mai 2027Sensors ConvergeSensor application and system side rather than the fab side.Santa Clara Convention Center
- 1 juin – 4 juin 2027IEEE Electronic Components and Technology ConferenceECTC 2027The world's leading advanced-packaging technical conference: HBM, hybrid bonding, chiplets.Denver, Gaylord Rockies
Associations, études de marché et médias spécialisés
Une liste courte et assumée plutôt qu’un annuaire — ce sont les sources qui couvrent réellement les MEMS, la puissance, les semi-conducteurs composés et le packaging avancé.
Associations et normalisation
- China Semiconductor Industry Association中国半导体行业协会Has dedicated MEMS, discrete device and packaging/test branches — close to our segments.
- ECPE European Center for Power ElectronicsEurope's power electronics research network — automotive power modules, reliability working groups.
- IEEE Electron Devices SocietyPower, sensors, MEMS and photovoltaics; publishes T-ED and EDL and runs IEDM.
- MEMS & Sensors Industry GroupThe MEMS and sensor community inside SEMI; runs MSEC and MSTC.
- Semiconductor Equipment Association of Japan日本半導体製造装置協会（SEAJ）Monthly equipment billings and the global equipment forecast — the reference series for the tool market.
- SEMIThe global equipment and materials association: standards, SEMICON shows and market data.
- SEMI ChinaSEMI 中国SEMICON China, standards work and mainland market data.
- Taiwan Semiconductor Industry Association台灣半導體產業協會Quarterly Taiwan IC output data; Taiwan's WSTS and WSC representative.
Études de marché et données
- MEMS Consulting麦姆斯咨询The only dedicated MEMS and sensor research house working in Chinese.
- SEMI Market IntelligenceWorld Fab Forecast plus a dedicated Power & Compound Fab Outlook — the closest fit to this site's segments.
- TechInsightsReverse engineering, teardowns and cost analysis, with explicit advanced-packaging coverage.
- TechSearch InternationalAdvanced packaging specialists since 1987: flip chip, WLP, power-device and automotive packaging.
- TrendForce集邦科技 / 集邦咨询Memory, foundry, LED and a compound semiconductor research line; widely quoted across Greater China.
- Yole GroupThe reference house for MEMS, power, compound semiconductor and packaging — reports plus teardowns.
Médias spécialisés — chinois simplifié
- China Electronics News中国电子报The MIIT-supervised trade paper — read it for policy direction. Linked to its digital edition, which is reachable worldwide.
- EEFocus与非网Electronics portal with genuine SiC/MOSFET, MEMS and advanced-packaging coverage, plus an engineer community.
- EE Times China电子工程专辑Has a dedicated power management and power device section for design engineers.
- IJIWEI爱集微 / 集微网Supply-chain news and capital-market coverage across the mainland ICT industry.
- MEMS.me微迷MEMS and sensor market coverage, run by MEMS Consulting.
- Semiconductor Industry Observation半导体行业观察The most widely read original semiconductor publication in mainland China.
Médias spécialisés — chinois traditionnel
- CTIMES零組件雜誌Components and subsystems since 1991 — closer to design and procurement than to the fab.
- DIGITIMES AsiaThe English sister title, for readers who do not work in Chinese.
- DIGITIMES電子時報Taiwan's deepest supply-chain daily; its semiconductor channel covers compound and power devices. Paywalled.
- TechNews科技新報Free to read, with a semiconductor vertical covering fabs, IC design and packaging/test.
Médias spécialisés — japonais
- EDN JapanDesign-side sister title: analog, power devices, sensors and measurement.
- EE Times JapanSections for MEMS/sensing, power devices and advanced packaging — the closest Japanese fit.
- Nikkei xTECH日経クロステックNikkei BP's technology platform and the gateway to Nikkei Electronics. Partly paywalled.
- Electronic Device Industry News電子デバイス産業新聞Weekly trade paper on devices, components and manufacturing equipment. Formerly Semiconductor Industry News.
Médias spécialisés — anglais
- 3D InCitesThe advanced-packaging community platform — blogs, podcasts, white papers. Now part of IMAPS.
- Chip Scale ReviewPackaging quarterly: hybrid bonding, 3D IC, chiplets, packaging equipment and test. Free digital edition.
- Compound SemiconductorWhole-chain compound semiconductor news; the publisher also runs CS International.
- EE TimesBroad electronics industry news and analysis, with IC and power electronics desks.
- Power Electronics NewsThe most focused wide-bandgap title: GaN and SiC devices, conversion, battery.
- Semiconductor DigestSuccessor to Solid State Technology, whose 30-year archive it hosts. Covers MEMS and fab process.
- Semiconductor TodayPure compound semiconductor: GaN, SiC, GaAs, InP, LED and photonics. The best fit on this list.
- Semiconductor EngineeringIndependent and free; unusually strong on advanced packaging and chiplets.
Médias spécialisés — allemand et français
- eeNews EuropePan-European electronics news in English, with a dedicated power channel.
- ElectroniqueSFrench-language coverage of semiconductors, power, RF and sensors across automotive, industrial and space.
- Markt&Technik / elektroniknet.deThe German-language reference for semiconductors, power and optoelectronics.
- ElektronikPraxisSemiconductor technology, power design and electronics manufacturing for German engineers.
Tous les liens mènent à des sites tiers. RayFan n’est pas affilié à ces organisations et ne contrôle pas leur contenu.
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