Branche
Wo sich diese Branche trifft und publiziert
Eine Arbeitsliste, die wir selbst führen und offen teilen: die Veranstaltungen, auf denen Spezialprozessanlagen wirklich besprochen werden, und die Quellen, die wir lesen. Alle Links führen direkt zu Veranstaltern und Verlagen.
Messen & Fachkonferenzen
Nach Region gruppiert. Vergangene Termine verschwinden automatisch; Daten stammen vom Veranstalter und sind gekennzeichnet, wenn noch nicht angekündigt.
Großchina
- 2. Sept. – 4. Sept. 2026SEMICON TaiwanTaiwan's foundry and advanced-packaging supply chain in one hall; conferences start 31 Aug.Taipei, TaiNEX 1 & 2
- 21. März – 23. März 2027China Semiconductor Technology International ConferenceCSTIC 2027The academic entrance to mainland fab process and R&D decision-makers. Abstracts close 30 Sep 2026.Shanghai International Convention Center
- 24. März – 26. März 2027productronica ShanghaiBack-end, packaging and electronics manufacturing equipment. Renamed from productronica China.Shanghai, SNIEC
- 24. März – 26. März 2027SEMICON ChinaThe anchor event of the year for equipment procurement and channels in mainland China.Shanghai, SNIEC
- June 2027 · Taipei — organiser has not posted final datesIEEE International Symposium on Power Semiconductor Devices and ICsISPSD 2027The flagship power-device conference, in Taipei for the first time — convenient for customers on both sides of the strait.Taipei
Asien-Pazifik
- 27. Sept. – 2. Okt. 2026International Conference on Silicon Carbide and Related MaterialsICSCRM 2026The reference conference for silicon carbide, from substrate through device.Yokohama, PACIFICO North
- 8. Nov. – 13. Nov. 2026International Workshop on Nitride SemiconductorsIWN 2026Biennial workshop on GaN and nitride materials, epitaxy and devices.Kumamoto, Japan
- 9. Dez. – 11. Dez. 2026SEMICON JapanWhere Japanese equipment and materials makers show once a year, including MEMS and compound tooling.Tokyo Big Sight
- 17. Feb. – 19. Feb. 2027SEMICON KoreaMemory and advanced-packaging procurement chain in Korea.Seoul, COEX
- 25. Mai – 27. Mai 2027SEMICON Southeast AsiaSEMICON SEA 2027Southeast Asian OSAT and capacity relocation. The show alternates between Malaysia and Singapore.Kuala Lumpur, MITEC
Europa
- 10. Nov. – 13. Nov. 2026SEMICON EuropaEurope's IDMs and research institutes in one place; co-located with electronica in even years.Munich, Messe München
- 12. Apr. – 14. Apr. 2027CS InternationalThe densest commercial gathering for compound semiconductors, co-located with PIC and Power Electronics International.Brussels, Sheraton Brussels Airport
- 11. Mai – 13. Mai 2027PCIM Expo & ConferenceEurope's largest power electronics show — the demand side for SiC and GaN device lines.Nuremberg
- 20. Juni – 24. Juni 2027Transducers 2027 – EUROSENSORS XXXIXThe other flagship MEMS conference, now merged with EUROSENSORS. Abstracts close 8 Dec 2026.Stockholm Waterfront
- 19. Sept. – 24. Sept. 2027International Conference on Silicon Carbide and Related MaterialsICSCRM 202724th edition; the annual fixture for anyone working on silicon carbide.Newport, ICC Wales
- November 2026 · during SEMICON Europa — exact dates to be confirmedMEMS & Imaging Sensors SummitSmall, senior European gathering for MEMS and imaging sensor decision-makers.Munich
Amerika
- 13. Okt. – 15. Okt. 2026SEMICON WestThe last San Francisco edition — from 2027 the show moves to Phoenix and to a spring slot.San Francisco, Moscone Center
- 12. Dez. – 16. Dez. 2026IEEE International Electron Devices MeetingIEDM 2026The device-level bellwether — read it to see where SiC and GaN roadmaps are heading.San Francisco, Hilton Union Square
- 17. Jan. – 21. Jan. 2027IEEE International Conference on Micro Electro Mechanical SystemsIEEE MEMS 2027One of the two flagship academic MEMS conferences; useful for university and pilot-line contacts.Waikoloa, Hawaii
- 30. März – 1. Apr. 2027SEMICON WestFirst Phoenix edition and first spring slot, moving the show next to the Arizona fab cluster.Phoenix Convention Center
- 5. Mai – 7. Mai 2027Sensors ConvergeSensor application and system side rather than the fab side.Santa Clara Convention Center
- 1. Juni – 4. Juni 2027IEEE Electronic Components and Technology ConferenceECTC 2027The world's leading advanced-packaging technical conference: HBM, hybrid bonding, chiplets.Denver, Gaylord Rockies
Verbände, Marktforschung und Fachmedien
Eine kurze, bewusst ausgewählte Liste statt eines Verzeichnisses — Quellen, die MEMS, Leistungselektronik, Verbindungshalbleiter und Advanced Packaging tatsächlich abdecken.
Verbände & Normung
- China Semiconductor Industry Association中国半导体行业协会Has dedicated MEMS, discrete device and packaging/test branches — close to our segments.
- ECPE European Center for Power ElectronicsEurope's power electronics research network — automotive power modules, reliability working groups.
- IEEE Electron Devices SocietyPower, sensors, MEMS and photovoltaics; publishes T-ED and EDL and runs IEDM.
- MEMS & Sensors Industry GroupThe MEMS and sensor community inside SEMI; runs MSEC and MSTC.
- Semiconductor Equipment Association of Japan日本半導体製造装置協会（SEAJ）Monthly equipment billings and the global equipment forecast — the reference series for the tool market.
- SEMIThe global equipment and materials association: standards, SEMICON shows and market data.
- SEMI ChinaSEMI 中国SEMICON China, standards work and mainland market data.
- Taiwan Semiconductor Industry Association台灣半導體產業協會Quarterly Taiwan IC output data; Taiwan's WSTS and WSC representative.
Marktforschung & Daten
- MEMS Consulting麦姆斯咨询The only dedicated MEMS and sensor research house working in Chinese.
- SEMI Market IntelligenceWorld Fab Forecast plus a dedicated Power & Compound Fab Outlook — the closest fit to this site's segments.
- TechInsightsReverse engineering, teardowns and cost analysis, with explicit advanced-packaging coverage.
- TechSearch InternationalAdvanced packaging specialists since 1987: flip chip, WLP, power-device and automotive packaging.
- TrendForce集邦科技 / 集邦咨询Memory, foundry, LED and a compound semiconductor research line; widely quoted across Greater China.
- Yole GroupThe reference house for MEMS, power, compound semiconductor and packaging — reports plus teardowns.
Fachmedien — Chinesisch (vereinfacht)
- China Electronics News中国电子报The MIIT-supervised trade paper — read it for policy direction. Linked to its digital edition, which is reachable worldwide.
- EEFocus与非网Electronics portal with genuine SiC/MOSFET, MEMS and advanced-packaging coverage, plus an engineer community.
- EE Times China电子工程专辑Has a dedicated power management and power device section for design engineers.
- IJIWEI爱集微 / 集微网Supply-chain news and capital-market coverage across the mainland ICT industry.
- MEMS.me微迷MEMS and sensor market coverage, run by MEMS Consulting.
- Semiconductor Industry Observation半导体行业观察The most widely read original semiconductor publication in mainland China.
Fachmedien — Chinesisch (traditionell)
- CTIMES零組件雜誌Components and subsystems since 1991 — closer to design and procurement than to the fab.
- DIGITIMES AsiaThe English sister title, for readers who do not work in Chinese.
- DIGITIMES電子時報Taiwan's deepest supply-chain daily; its semiconductor channel covers compound and power devices. Paywalled.
- TechNews科技新報Free to read, with a semiconductor vertical covering fabs, IC design and packaging/test.
Fachmedien — Japanisch
- EDN JapanDesign-side sister title: analog, power devices, sensors and measurement.
- EE Times JapanSections for MEMS/sensing, power devices and advanced packaging — the closest Japanese fit.
- Nikkei xTECH日経クロステックNikkei BP's technology platform and the gateway to Nikkei Electronics. Partly paywalled.
- Electronic Device Industry News電子デバイス産業新聞Weekly trade paper on devices, components and manufacturing equipment. Formerly Semiconductor Industry News.
Fachmedien — Englisch
- 3D InCitesThe advanced-packaging community platform — blogs, podcasts, white papers. Now part of IMAPS.
- Chip Scale ReviewPackaging quarterly: hybrid bonding, 3D IC, chiplets, packaging equipment and test. Free digital edition.
- Compound SemiconductorWhole-chain compound semiconductor news; the publisher also runs CS International.
- EE TimesBroad electronics industry news and analysis, with IC and power electronics desks.
- Power Electronics NewsThe most focused wide-bandgap title: GaN and SiC devices, conversion, battery.
- Semiconductor DigestSuccessor to Solid State Technology, whose 30-year archive it hosts. Covers MEMS and fab process.
- Semiconductor TodayPure compound semiconductor: GaN, SiC, GaAs, InP, LED and photonics. The best fit on this list.
- Semiconductor EngineeringIndependent and free; unusually strong on advanced packaging and chiplets.
Fachmedien — Deutsch & Französisch
- eeNews EuropePan-European electronics news in English, with a dedicated power channel.
- ElectroniqueSFrench-language coverage of semiconductors, power, RF and sensors across automotive, industrial and space.
- Markt&Technik / elektroniknet.deThe German-language reference for semiconductors, power and optoelectronics.
- ElektronikPraxisSemiconductor technology, power design and electronics manufacturing for German engineers.
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