Technologies

Batch thermal processing

Oxidation, diffusion, anneal and LPCVD remain the quiet backbone of power-device, sensor and specialty-CMOS flows. Batch furnaces deliver these steps with an economy single-wafer tools cannot match — when temperature uniformity, ambient control and automation fit the application.

What it does

Batch furnace systems process stacks of wafers through precisely controlled thermal and gas-ambient recipes: growing oxides, driving dopants, densifying and annealing films, and depositing LPCVD layers such as polysilicon and nitride. Vertical architectures dominate modern installations; the right choice depends on wafer size, throughput and cleanroom integration.

Evaluation dimensions that decide projects

Temperature uniformity
Across the load and along the recipe — the direct driver of film and junction uniformity.
Ambient & contamination control
Gas purity, moisture behaviour and metallic contamination performance appropriate to the device class.
Recipe flexibility
The realistic set of oxidation, anneal and deposition processes one system serves without compromise.
Automation & integration
Loading architecture, wafer handling and factory-automation fit for the intended cleanroom.
Cost per wafer pass
Batch size, cycle time, energy and maintenance profile over the tool’s life — where batch thermal earns its keep.

Questions worth asking early

Batch or single-wafer?

Batch wins on cost for long, stable thermal steps at volume; single-wafer wins on cycle time and per-wafer ambient control. The crossover is application-specific — model it with your real recipe mix.

What matters in a furnace evaluation?

Uniformity data on full loads, ramp behaviour with your thermal budget, particle and contamination performance, and the automation interface your fab actually uses.

Have a structure, film or thermal step to discuss?

Send a short description of your application — device type, material, wafer size and what a good result looks like. An engineer will reply with a concrete next step.

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